2016 High Quality Aluminum Base LED PCB
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Origin
China Mainland
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Minimum Order
1
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Packing
Pieces
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KEDING is well-known as one of the professional 2016 high quality aluminum base led pcb manufacturers and suppliers in China, which is equipped with one of the famous PCB brands. We can offer you customized 2016 high quality aluminum base led pcb. Should you want to buy or wholesale our cheap bulk PCB at a discount, please contact us and we also can offer free sample if necessary.
Model NO.: Aluminium PCB-10
Dielectric: Aluminium
Flame Retardant Properties: V0
Processing Technology: Electrolytic Foil
Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm
Sample Date: 3-5days
Package: Vacuum Packing
Origin: China
Type: Rigid Circuit Board
Material: Fiberglass Epoxy
Mechanical Rigid: Rigid
Base Material: Aluminum
Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K
Trademark: ZAPON
Specification: UL, TS16949, IPC 600 CLASS 2
HS Code: 85340090
It's widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-A, CCAF-05etc. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc.
Thickness of the copper: 18um, 35um, 70um, 105um.
Base size: 500mm ×, 600mm (20"×, 24"); 600mm ×, 1060mm (24"×, 42")
CCAF-01 Aluminum-base copper-clad laminate
The test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 70um
Thickness of the aluminum-base: 1.5mm
The result of the test:
Technique parameter:
Item | Test item | Technology request | Unit | Test result | ||
1 | Peel Strength | A | ≥ 1.8 | N/mm | 2 | |
After thermal stress (260ordm;C) | ≥ 1.8 | N/mm | 1.8 | |||
2 | Blister test AfterThermal stress (260ºC, 2min ) | No delaminating | / | Ok | ||
3 | Flammability(A) | FV-O | / | FV-O | ||
4 | Thermal resistance | ≤ 2.0 | ordm;C /W | 1 | ||
5 | Surface Resistivity | A | ≥ 1 × 10 5 | M Ω | 5 × 10 7 | |
Constant humidity treatment | ≥ 1 × 10 5 | M Ω | 2 × 10 6 | |||
(90%,3 5 ordm;C,96h) | ||||||
6 | Volume Resistivity | A | ≥ 1 × 10 6 | M Ω· m | 4 × 10 8 | |
Constant humidity treatment | ≥ 1 × 10 6 | M Ω· m | 5 × 10 7 | |||
(90%,3 5ordm;C ,96h) | ||||||
7 | Dielectric Breakdown ( DC ) | ≥ 28.5 | Kv/mm | 31 | ||
8 | Dielectric constant (1MHz ) | ≤ 4.4 | / | 4.2 | ||
(40 ordm;C,93% , 96h ) | ||||||
9 | Dielectric dissipation factor (1MHz ) | ≤ 0.03 | / | 0.02 | ||
(40 ordm;C, 93% ,96h ) | ||||||
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